Greater Uptime

All aspects of the PACSystems RXi2-BP IPC have been

engineered for reliability in harsh environments. With high

quality industrial components, a rugged design, and fanless

operation, it is perfect for both commercial and industrial

applications. The PACSystems RXi2-BP IPC is a highly reliable

IPC with a long life cycle.

The foundation of the PACSystems RXi2-BP IPC architecture

is Emerson’s rugged COM Express modular CPU platform.

Emerson also incorporates patented thermal monitoring

technology with sophisticated passive cooling techniques

to provide the highest-performance, fanless industrial

computing platform that can operate in extended

temperature ranges.

The foundation of the PACSystems RXi2-BP IPC combines

high performance with reliability, enhancing productivity

and reducing cost of ownership. The PACSystems RXi2-BP

IPC delivers low TCO through features such as compact size,

reduced maintenance, low power consumption, and ease

of future performance upgrades enabled by our innovative

rugged COM Express CPU architecture.