​The versatile T5833 memory test system combines industry

leading performance and low cost of test to maximize customers’

return on investment. The tester is designed to perform both wafer

sort and final test across a wide range of memory devices including

LPDDR3-DRAMs, MCPs, high-speed NAND flash memories and

next-generation non-volatile memory ICs.

High-Capacity Testing

The T5833 can achieve high throughput by simultaneously

performing wafer-level testing on 2.048 devices or final package

testing on 512 devices.

Known good die (KGD) testing can be conducted at speeds up to 2.4

Gbps.  In addition, the tester performs high-speed failure capture and

memory-redundancy analysis with AFM and MRA options, two key tasks

needed for memory wafer sort. These fast functions reduce test times

while enabling the recovery of more memory ICs for improved yields.

Designed for Scalability

The tester is built on ADVANTEST’s modular AS Platform, making

it configurable to meet each user’s specific needs.  The system is

scalable for applications ranging from device engineering to large

volume production, and its functionality can be extended with

module upgrades to handle future generations of devices.

The real-time source synchronous function increases yield and

reduces test times while the T5833’s tester-per-site architecture

reduces test times even further for NAND and other non-volatile

memory devices.