Enabling high-precision CO2 laser drilling for advanced PCB processing:

SCANLAB’s intelliDRILLse II and the new excelliDRILL are specialized

scan systems designed for demanding microdrilling tasks such as high

density interconnects (HDI).

Modern printed circuit boards require an ever-increasing number of

vertical interconnects, also known as vias. The density of these

interconnects continues to increase, while their size decreases.

Precision is of central importance for the functional implementation of

such designs. At the same time, manufacturing methods must offer very

high throughput.

Technology Overview

Laser drilling is an ideal process for the application, as it allows a very large

number of fine holes to be produced with a very high degree of precision.

For CO2 drilling processes, the laser spot has to be moved to a designated

position and it has to be settled precisely within tolerance, whereafter the

laser is triggered. A key requirement for this is a suitable scan system that

is capable of performing this “jump and shoot” process with maximum

efficiency. intelliDRILLse II and excelliDRILL are developed to meet the

specific requirements of high-precision microdrilling tasks.