Enhanced Productivity &

Lower Total Cost of Ownership (TCO)

The foundation of the PACSystems RXi2-BP IPC combines

high performance with reliability, enhancing productivity

and reducing cost of ownership. The PACSystems RXi2-BP

IPC delivers low TCO through features such as compact size,

reduced maintenance, low power consumption, and ease

of future performance upgrades enabled by our innovative

rugged COM Express CPU architecture.

Greater Uptime

All aspects of the PACSystems RXi2-BP IPC have been

engineered for reliability in harsh environments. With high

quality industrial components, a rugged design, and fanless

operation, it is perfect for both commercial and industrial

applications. The PACSystems RXi2-BP IPC is a highly reliable

IPC with a long life cycle.

The foundation of the PACSystems RXi2-BP IPC architecture

is Emerson’s rugged COM Express modular CPU platform.

Emerson also incorporates patented thermal monitoring

technology with sophisticated passive cooling techniques

to provide the highest-performance, fanless industrial

computing platform that can operate in extended

temperature ranges.