3 x 1 = One and ultrafast

With reACTION technology, time-critical subpro

cesses are executed with down to 1 µs directly on

the I/O module. Three subcomponents – terminal

block, electronics module and bus module – come

together to form this module. This modularity re

sults in a system that combines the advantages

of both rack and I/O slice systems:

< Prewiring without the module

< Hot pluggable electronics

< Extra bus slots for added options

Highlights

< Intel® Atom™ performance

< Fanless and maintenance-free

< Onboard POWERLINK

< Onboard Ethernet and USB

< Removable terminal blocks

< Hot-pluggable electronics

< 16 channels with total width of only 12.5 mm

< Open for all fieldbus systems

< Ultrafast I/O responses

< X20c