Overview

This is a rack-mount industrial PC / system controller assembly for AMAT CMP

(Chemical Mechanical Planarization) semiconductor polishing tools, assembled

in USA. It acts as the main process control unit for CMP polishing head, platen,

slurry, endpoint, motion and I/O sequencing of the wafer planarization system.

Main Internal Components

Industrial motherboard: ADLINK MI-220

DAC/ADC board: PCB 1007-0101

Interface board: T115-0005 / PCB 1007-0097 REV 2C

Power supply: SOLA SDN 20-24-100C (24V DC power module)

Mechanical & Physical Info

Form factor: 4U rack mount enclosure with front handles

Weight: ~22 kg

Front panel: Power switch + 6 control buttons

Rear panel: Multiple DB serial ports, USB, power inlet, analog/digital I/O terminals

Cooling: Internal fan forced air cooling

Function

• Host control of CMP process recipe execution

• Real-time acquisition of polishing pressure, platen speed, temperature, slurry

flow and endpoint signals

• Motion control and interlock safety logic for CMP polishing head and platens

• Communication between tool host, chamber sensors and actuator subsystems

• Data logging, fault diagnosis and tool state management for CMP platform

Application

Applied Materials Reflexion series 300mm CMP polishing tools for wafer

planarization in semiconductor fab.