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AMAT Applied Materials Aera 6 Mask Inspection

The Applied Aera™ 6 Mask Inspection system is a sixth generation 193nm-based

inspection tool, unique in combining true aerial imaging with cutting-edge

high-resolution imaging.

Equipped with a new lithography-grade lens and double CCD system, the Aera 6

demonstrates enhanced signal-to-noise ratio for both standard high-resolution

applications and aerial inspection with improved throughput. Such capabilities

makes it the tool of choice for Memory and Logic most advanced nodes, including

those with aggressive optical proximity correction, such as inverse lithography

and EUV mask inspection. The system performs highly sensitive mask inspection,

as required for double- and quadruple-patterning lithography technologies, while

maintaining a very low false alarm rate.

Designed to emulate a lithography scanner, the Aera 6 system delivers a higher

inspection success rate over other high-resolution inspection systems with

advanced masks. Combined with its inherent automatic defect classification as

printing or non-printing, and by focusing on advanced AI algorithmic solutions,

the system allows mask makers to extend ArF technology to next-generation

nodes.

The Aera 6 system expands the mask inspection capabilities of mask shops and

fabs to promote longer mask lifetimes and reduce mask-related costs.

These capabilities include early haze detection, complete 193nm and EUV exposure

-degradation monitoring, 2.5nm resolution review of edge dislocation defects, and

full-mask critical dimension (CD) uniformity mapping using the IntenCD™ system.​

AMAT Applied Materials Cmp Tool Controller 0195-14157

Overview

This is a rack-mount industrial PC / system controller assembly for AMAT CMP

(Chemical Mechanical Planarization) semiconductor polishing tools, assembled

in USA. It acts as the main process control unit for CMP polishing head, platen,

slurry, endpoint, motion and I/O sequencing of the wafer planarization system.

Main Internal Components

Industrial motherboard: ADLINK MI-220

DAC/ADC board: PCB 1007-0101

Interface board: T115-0005 / PCB 1007-0097 REV 2C

Power supply: SOLA SDN 20-24-100C (24V DC power module)

Mechanical & Physical Info

Form factor: 4U rack mount enclosure with front handles

Weight: ~22 kg

Front panel: Power switch + 6 control buttons

Rear panel: Multiple DB serial ports, USB, power inlet, analog/digital I/O terminals

Cooling: Internal fan forced air cooling

Function

• Host control of CMP process recipe execution

• Real-time acquisition of polishing pressure, platen speed, temperature, slurry

flow and endpoint signals

• Motion control and interlock safety logic for CMP polishing head and platens

• Communication between tool host, chamber sensors and actuator subsystems

• Data logging, fault diagnosis and tool state management for CMP platform

Application

Applied Materials Reflexion series 300mm CMP polishing tools for wafer

planarization in semiconductor fab.

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