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Emerson DeltaV™ M-series Traditional I/O Cards

The Traditional I/O subsystem includes:

• I/O interface carrier (a DIN rail surface mounted)

on which all I/O related components are installed.

• Bulk AC to 24V DC power supply for field devices.

 An I/O interface consisting of an I/O card and an

I/O terminal block.

• A variety of analog and discrete I/O cards enclosed

in a common form factor that easily plugs into the

I/O interface carrier.

• A variety of I/O terminal blocks mounted on the I/O interface

carrier that can be pre-wired before I/O card installation.

The DeltaV system provides control module level time

stamping for log events and alarms. For greater event

resolution, the 16-channel Sequence-of-Events DI card

can provide signal driven events to a resolution of +/- 0.25 ms

per card, or within 1 ms per controller. Please refer to

the Sequence-of-Events PDS for more information on

Sequence-of-Event data collection and system options for this feature.

Kollmorgen AKD2G Servo Drives 2G Motion Control System Engineer more reliably

Engineer more reliably

Our highest motion control performance standards are perfectly matched to your application,

eliminating the risk of under- or over-performing components.

eliminating the risk of under- or over-performing components.

We offer reliable supply, application expertise, and personalized support that no other supplier can match.

We offer reliable supply, application expertise and personalized support that no other supplier can match.

Kollmorgen gives you the confidence to bring reliable and superior solutions to the global marketplace.

Kollmorgen gives you the confidence to bring reliable and superior solutions to the global marketplace.


Our highly regarded WorkBench GUI simplifies motion programming and debugging, and the drive’s graphic

display on the drive provides the information you need for efficient machine startup, troubleshooting and maintenance. Through our joint

design services, you can work directly with motion control experts 

who are committed to helping you achieve superior performance with a wide range of customized solutions.

customized solutions to help you achieve superior performance.

Emerson PACSystems™ RSTi-EP I/O High Density Simple Maintenance

Simple Maintenance

RSTi-EP lays a strong foundation for installation, machine

commissioning and service applications with robust and

easy-to-use signal connection components. LEDs on the

module and each channel help operators to quickly and

easily determine I/O health and quickly diagnose any

system failures.

Intutive Integration

The RSTI-EP features outstanding performance and

response time, with the high-speed system bus reading

up to 256 DI/ DOs in 20 microseconds. It offers intuitive

I/O mapping for quick and easy integration into

your control application, as well as maximum power

reserves for future applications. RSTi-EP features faster

backplane speeds than the original RSTi I/O and perfectly

responds to growing complexity in machine and factory

automation thanks to powerful flexibility and a consistent

user interface.

Emerson PACSystems™ RSTi-EP I/O High Density High Availability

High Availability

With the PNS101 network adapter, RSTi-EP supports

PROFINET System Redundancy (PNSR). This enables

synchronized independent controllers to service the I/O

and transition from active to back-up controller without

interruption. With controllers and processes resilient

from physical disruption, you can consider unplanned

downtime a thing of the past.

Consistent I/O cabling interfaces make installation faster

and more reliable. Color-keyed connectors allow for

fewer cabling errors and noticeably shorter installation

times. Better still, no tools are required for installation or

removal of I/O wiring connectors, saving time and effort.

Entire machine modules can be cabled and transferred

into production through a streamlined commissioning

process. Bulk swing-arm kits are available to enable cable

pre-assembly, offloading repetitive tasks for your team

during panel assembly.

Emerson PACSystems™ RSTi-EP I/O High Density Plug and Play Installation

Plug and Play Installation

Consistent I/O cabling interfaces make installation faster

and more reliable. Color-keyed connectors allow for

fewer cabling errors and noticeably shorter installation

times. Better still, no tools are required for installation or

removal of I/O wiring connectors, saving time and effort.

Entire machine modules can be cabled and transferred

into production through a streamlined commissioning

process. Bulk swing-arm kits are available to enable cable

pre-assembly, offloading repetitive tasks for your team

during panel assembly.

A single row connection level

facilitates wiring, installation, and service. Separate power

supplies for inputs and outputs reduce the number of

power feed modules needed and save space; additionally,

specific sections can be activated or deactivated without

affecting production thanks to the independence of the

input and output power busses.

Emerson PACSystems™ RSTi-EP I/O High Density Real-time Diagnostics

Remote, Real-time Diagnostics

With the RSTi-EP’s integrated web server and advanced

diagnostics, failures in the system can be identified

remotely, eliminating the need to travel to the machine,

saving both time and money. The web server lets the

operator view diagnostic faults and upgrade firmware

over the web– simplifying start up, increasing availability

and productivity without the need for additional tools or

software. Additionally, actions can be taken within the

application feeding off of the diagnostic information. It

is simple to prioritize service trips as critical or routine

maintenance without stepping out of the control room.

 It can accommodate up to 64 modules and 1024 I/O

points per drop, while its 11.5 mm I/O slices maximize

limited cabinet space. By adopting the most compact

I/O system on the market, it’s possible to incorporate

smaller cabinet sizes into user-friendly system designs.

You can even eliminate external components by using

optional potential distribution modules to provide

easy connections to input power, output power, and

functional earth.

Emerson PACSystems™ RSTi-EP I/O High Density Higher Performance


Higher Performance in Half the Space

The innovative RSTi-EP I/O is a powerful combination

of clean layout, high density, and small footprint. It

can accommodate up to 64 modules and 1024 I/O

points per drop, while its 11.5 mm I/O slices maximize

limited cabinet space. By adopting the most compact

I/O system on the market, it’s possible to incorporate

smaller cabinet sizes into user-friendly system designs.

You can even eliminate external components by using

optional potential distribution modules to provide

easy connections to input power, output power, and

functional earth.

RSTi-EP combines powerful technology and a modular,

compact form factor to deliver higher performance and

maximized productivity in today’s connected automation

systems. The RSTi-EP remote I/O system is well suited

for Industrial Internet enabled applications. It features

an extended operating temperature range, enhanced

diagnostics, plug-and-play connectivity and high channel

density– all designed to simplify machine design and

maintenance. Advanced diagnostics make RSTi-EP ideal

for remote applications, especially those where I/O can be

difficult to reach. RSTi-EP I/O is easily expandable, so you

can adapt and extend coverage as your system evolves.

Emerson PACSystems™ RSTi-EP I/O Smarter Architecture

Smarter Architecture

Today’s connected machines require innovative, high

performance control systems that minimize unplanned

downtime and increase productivity and efficiency.

RSTi-EP combines powerful technology and a modular,

compact form factor to deliver higher performance and

maximized productivity in today’s connected automation

systems. The RSTi-EP remote I/O system is well suited

for Industrial Internet enabled applications. It features

an extended operating temperature range, enhanced

diagnostics, plug-and-play connectivity and high channel

density– all designed to simplify machine design and

maintenance. Advanced diagnostics make RSTi-EP ideal

for remote applications, especially those where I/O can be

difficult to reach. RSTi-EP I/O is easily expandable, so you

can adapt and extend coverage as your system evolves.

Emerson I/O Link Interface Module IC694BEM320 Description


Module Description

The module’s front cover is removable. A jumper plug inside the front cover is used to set up the

module as a 32–point or 64–point I/O module.

Serial Ports

The front of the module has two 20–pin connectors that are used to attach the I/O Link cable.

One connector is for the cable to the previous device on the link––either the master or another

slave. The other connector is for the cable to the next slave on the link, if there is one.  See the

RX3i I/O Link Modules User’s Manual, GFK-2358 for more information. Signal levels are

RS422/485 compatible.


An I/O Link Interface Module occupies one module slot in an

RX3i backplane.  It can be installed in any available backplane slot.

The maximum number of I/O Link Interface Modules that can be

installed in the backplane depends on the power that is available

from the power supply.  To determine the exact number of

modules allowed in your system, see the information on power

supplies in chapter 3.

Usually, when there are multiple I/O Link Interface Modules in the

same RX3i system, they are on separate I/O Links.  However, it

is possible to have more than one I/O Link Interface Module in

the system connected to the same link, if that suits the needs of

the application.

Emerson I/O Link Interface Module IC694BEM320

The RX3i I/O Link Interface Module operates as a slave on a

Fanuc I/O Link network.  It can exchange either 32 or 64 inputs

and outputs with the master.  Typical masters on the I/O Link

include all modern FANUC CNCs and Power Mates,

PACSystems controllers and Series 90 PLCs equipped with an

I/O Link Master Module.

An I/O Link Interface Module occupies one module slot in an

RX3i backplane.  It can be installed in any available backplane slot.

The maximum number of I/O Link Interface Modules that can be

installed in the backplane depends on the power that is available

from the power supply.  To determine the exact number of

modules allowed in your system, see the information on power

supplies in chapter 3.

Usually, when there are multiple I/O Link Interface Modules in the

same RX3i system, they are on separate I/O Links.  However, it

is possible to have more than one I/O Link Interface Module in

the system connected to the same link, if that suits the needs of

the application.

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