New tester delivers performance and speed

needed to test DDR4 and LPDDR4 memory ICs

used throughout portable electronics and servers

With today’s mobile electronic devices and the servers

that support them handling ever-increasing volumes

of data, semiconductor memory manufacturers need a

highly capable, cost-efficient means of testing their latest

generations of high-speed, high-capacity memory ICs –

including emerging DDR4-SDRAM and LPDDR4-SDRAM

chips. ADVANTEST’s T5503HS tester gives memory

manufacturers that industry-leading performance and a

low cost of test along with an upgradable system design.

Extendible lifetime

With its modular architecture, the T5503HS is designed to help

customers get the most value from their capital investments.

The system is available as a fully compatible upgrade on

ADVANTEST’s field-proven T5503 test platform.  This enables

users to extend the performance of their existing testers while

also getting greater ROI as next-generation ICs are introduced.

A High-Throughput Tester Optimal for Mass-production of

High-speed Devices such as DDR2-SDRAMs

As cell phones and notebook PCs become more compactand yet

incorporate ever more enhanced functionality, memory devices

have corre spondingly increased in speed and in storage capacity.

Meanwhile, volume-production solutions that deliver lower

overall cost-of-test for testing high-speed devices such as

DDR2-SDRAMs are in increased demand.

The T5588 meets such market demands with a maximum

testing rate of 800 Mbps and by allowing the simultaneous

testing of up to 512 devices. This enables high throughput

testing at greatly reducedcosts. T5588 is also the first DRAM

package tester to offer an optional flash memory test

function, making it uniquely adaptable to changing market

conditions.

Simultaneous Testing of Up to 512 Devices

The optimum number of pins for testing DDR2-SDRAMs

has been mounted on the T5588 to help it achieve simultaneous

testing of up to 512 devices.

Low Cost and Reduced Footprint

Owing to an original ASIC design developed using a cut ting-edge

CMOS process, the T5588 is able to cut costs by approximately 40%,

compared with our conventional model, and has a reduced footprint.

The Multi-language Operating System FutureSuite®

Use of the multi-language operating system FutureSuite allows

programming in the worldwide standard, C and ATL languages.

Application-specific Configurations

This versatile platform is available in various configurations,

each optimized to meet the customer’s distinct performance

and economic requirements:

•  The V93000 Versatile Digital solution addresses all

aspects of testing digital ICs, from wafer sorting to high-end

characterization.

•  For ICs for mobile applications, the V93000 Wireless/RF

solution can handle up to 96 ports with true octal-site and

high multi-site parallel efficiency at a minimal cost of test.

•  The V93000 SOC solution performs economic testing of

high-volume, cost-sensitive ICs while satisfying the testing

challenges of the latest mixed-signal devices used in

consumer electronics.

Scalable Tester Classes

Systems are available in four different classes – designated A,

C, S and L – featuring different test head sizes to provide the

most effective solution for each user’s specific applications.

These compatible tester classes allow users to quickly and

easily move their semiconductor devices from one Smart Scale

class to another as IC production volumes change over time.

Solutions for Advanced CMOS

The V93000 Smart Scale generation is designed to meet

the challenges of testing advanced, high-integration CMOS

technology.  Increased test coverage, faster time-to-market

and superior test economics are achieved with industry

leading digital performance, high-speed I/O flexibility,

system-like stress testing, protocol-engine-per-pin™

capabilities, real-time memory emulation, SmartLoop™

testing of symmetrical high-speed interfaces and enhanced

SmarTest™ software functionality.

Smarter Testing

ADVANTEST’s V93000 Smart Scale generation incorporates

innovative per-pin testing capabilities.

Each pin can

run with its own clock domain to match the exact data

rate requirements of the device under test, providing full

test coverage.  In addition, the testers are equipped for

power supply modulation, jitter injection and protocol

communication

Scalable platform combines the versatility to test

all types of semiconductor devices with “smart”

per-pin capabilities, enabling the industry’s most

cost-efficient test solutions

Reducing the cost of test requires not only innovative

technology, but also an extendable system architecture to

ensure long equipment lifetime for the greatest return on

customers’ capital investments.  ADVANTEST’s V93000

Smart Scale test platform is the semiconductor industry’s

first scalable, highly cost-efficient ATE solution to meet

these criteria, addressing the needs of leading IDMs,

foundries, design houses and OSATs around the world.

Scalable Tester Classes

Systems are available in four different classes – designated A,

C, S and L – featuring different test head sizes to provide the

most effective solution for each user’s specific applications.

These compatible tester classes allow users to quickly and

easily move their semiconductor devices from one Smart Scale

class to another as IC production volumes change over time.

T6373 Capable of 32 DUTs in Parallel Testing for 10-12 bit LCD Driver ICs

Global demand for LCD driver ICs is growing in response to an

expected sky rocketing in popularity for LCD televisions,

as well as liquid crystal panels for cellular phones with increasingly

rich feature sets. Tracking these developments, LCD driver ICs

are also growing in both pin count and function ality.

This evolution, however, has added to the importance of keeping

production costslow. The T6373 LCD driver test system offers an

optimal solution for customers facing this paradox.

Reducing Cost of Test for LCD Drivers with Large Pin Counts

The T6373 can be equipped with a maximum of 3.072 LCD channels

and 512 I/O channels. It supports four device parallel test for 640-pin

and 720-pin driver ICs, which will dominate in the future.

For driver ICs with BIST circuits, it could support up to 32 driver ICs.

Support for the Newest Driver ICs

The T6373’s high-speed/pre cision digitizer and DC (LCD ch) test

 unitare configured for per-pin operation. When testing many-pin/precision

(10 bit/1024 gradation) driver ICs, this tester boasts throughput of up 

to 150% greater than that of its predecessor.

Improved Support for Leveraging Legacy (T6372) Assets

By offering legacy support for the well-established test software, the

T6373 allows the customer to use valuable test assets, such as test

program environments, test boards, and probe cards,that supported

its predecessor model.

While preserving maximum compatibility with previous test systems,

the T6373 also allows the customer to minimize test costs.

Reducing cost of test by maximizing parallel test,allowing

flexible pin configurations

With greater test resourcesthan those of the T5377S, the T5383

supports greater device pin counts, and allows for higher levels of

parallelism:

up to 384 devices, 1.5 times greater than that of its prede cessor.

Also, its flexible pin assignment capability makes possible parallel

test with more flexibility and variety than ever before.

This granularity of tester resources optimizes test-cell configurations,

and further reduces cost of test.

Industry’s Fastest Test, Shortest Test Times

The T5383 operates at 286 MHz/572 Mbps, double the speed of T5377S,

making it the industry’s fastest offering in this product category.

This increased speed translates into shorter test times, as well as higher

fault coverage, including Known Good Die applications.

Further, enhanced memory repair analyzer hardware (the MRA4ev3

and DualAFMoption) delivers approximately double the throughput of

previous products. Faster processing speeds and dedicated high speed

data communications enable production bitmap yield learning. At the

same time, they prevent analysis times from increasing,even as device

counts and densities grow larger.

T5383

Parallel Test for Up to 384 Devices.

Flexible Pin Configuration Drives Lower Cost of Test.

In the DRAM manufacturing process, shrinking geometries

for 300 mm wafers are taking device densities and speeds to

a new level. At the same time, proliferating cellular tele

phones, personal computers,various digital appliances, are

propelling demand for memory, particularly multilayer SIP

(System-in-Package) devices. The T5383 provides a timely

response to these trends. From front-end test for DRAM to

back-end test for FLASH memory, MCP/SIP, and other devices,

the T5383 provides a high-throughput solution that offers flexible

support for increasingly fast and versatile memory devices.

In addition, T5383 high-density pin electronics deliver 50% more

capacity than provided by its prede cessor, T5377S, and within

the same small footprint.

Compatible with previous products

The T5383 uses FutureSuite, with its multi-language support, as its OS.

FutureSuite® is compatible with the ATL language, supporting thou

sands of applications, and also allows programming in ADVANTEST’s

C-based MCI (Multi Control Interface). These capabilities enable the

user to make selections tailored to evolving programming needs while

leveraging existing implementations.

Advantest’s T5503 8448

Channel Test Head addresses these needs, with superior throughput and lowered

test costs for high-speed manufacturing. When coupled with Advantest’s M6242

handler, the T5503 provides a DDR3 test cell that delivers performance and yield

as well as the industry’s lowest cost of volume production test.

Up to 3.2Gbps of test speed and 256 device parallel test For package test of the

new generation high-speed memory DDR3-SDRAM, the T5503 achieves the fastest

test speeds in the industry  of 3.2Gbps.

while delivering parallel test of up to 256 devices (four times that of its predecessors).

This contributes to a major reduction in test costs for high volume production lines and

makes it an ideal solution for DDR3-SDRAM, as well as for GDDR3 and GDDR4.

In addition, the T5503 provides an enriched multi-strobe function to measure the phase

difference between the reference clock signal and data output signals at each cycle,

— a significant benefit as the operating frequencies becomes higher.

This function helps to measure the characteristics of memory devices at high speeds

with a high level of accuracy.

Reduced power requirements and a space savings of 30% By adopting the latest CMOS

technology, a high degree of integration has been achieved in the semiconductor circuits

mounted on the tester. While realizing four times the parallel test capacity of the earlier

version, the new system configuration has a 30% smaller footprint, contributing to an

energy-efficient and space-saving production line environment.

Using FutureSuite®, with multi-language support Advantest’s proprietary FutureSuite

software with multi-language support enhances the system’s operating system.

In addition, the conventional ATL language, the MCI (Multi Control Interface)

language allows programming in C.

T5503

256-DUT Parallel Test Capacity for Mass Production Test of

High Speed DDR3-SDRAM Memory Devices

Broadband communications are now widely used in households and

businesses throughout the globe and expectations are growing for higher

quality and larger capacity applications including video, audio,and on-line content. 

The demand for low-power, very high-speed memory to drive these applications

is prompting the near-term transition from DDR2-SDRAM to DDR3-SDRAM.

DDR3’s increased performance, coupled with lower power requirements,

promise to measurably enhance the capabilities of equipment such as

PCs, notebooks and servers, as well as advanced consumer products

such as game consoles and HDTV.

Accompanying the shift from DDR2-SDRAM to the faster DDR3-SDRAM,

is a corresponding requirement from device manufacturers for higher-speed

and more accurate test capabilities, and an insistence on lowered test costs

for mass production of these new high-speed devices. Advantest’s T5503 8448

Channel Test Head addresses these needs, with superior throughput and lowered

test costs for high-speed manufacturing.